US Patent Issued to STMICROELECTRONICS on Feb. 3 for "Bottom package exposed die MEMS pressure sensor integrated circuit package design" (Philippine Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,575, issued on Feb. 3, was assigned to STMICROELECTRONICS INC. (Calamba, Philippines).

"Bottom package exposed die MEMS pressure sensor integrated circuit package design" was invented by Aaron Cadag (Calamba, Philippines), Frederick Arellano (Cabuyao, Philippines) and Ernesto Antilano Jr. (Binan Laguna, Philippines).

According to the abstract* released by the U.S. Patent & Trademark Office: "A MEMS pressure sensor packaged with a molding compound. The MEMS pressure sensor features a lead frame, a MEMS semiconductor die, a second semiconductor die, multiple pluralities of bonding wires, and a molding compound. The MEMS semiconductor die has an internal chamber, a sensing component,...