ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,447, issued on Dec. 9, was assigned to STMicroelectronics Pte Ltd (Singapore).
"Low cost wafer level packages and silicon" was invented by Jing-En Luan (Singapore).
According to the abstract* released by the U.S. Patent & Trademark Office: "Described herein is a method of forming wafer-level packages from a wafer. The method includes adhesively attaching front sides of first integrated circuits within the wafer to back sides of second integrated circuits such that pads on the front sides of the first integrated circuits and pads on front sides of the second integrated circuits are exposed. The method further includes forming a laser direct structuring (LDS) activatable layer over ...