US Patent Issued to STMICROELECTRONICS on Dec. 9 for "Leadframe with varying thicknesses and method of manufacturing semiconductor packages" (Philippine Inventor)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,442, issued on Dec. 9, was assigned to STMICROELECTRONICS INC. (Calamba, Philippines).

"Leadframe with varying thicknesses and method of manufacturing semiconductor packages" was invented by Jefferson Sismundo Talledo (Calamba, Philippines).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to semiconductor packages manufactured utilizing a leadframe with varying thicknesses. The leadframe with varying thicknesses has a reduced likelihood of deformation while being handled during the manufacturing of the semiconductor packages as well as when being handled during a shipping process. The method of manufacturing is not req...