US Patent Issued to STMicroelectronics on Dec. 23 for "Method of assembling semiconductor devices and corresponding semiconductor device" (Italian Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,053, issued on Dec. 23, was assigned to STMicroelectronics S.r.l. (Agrate Brianza, Italy).

"Method of assembling semiconductor devices and corresponding semiconductor device" was invented by Matteo De Santa (Lombardia, Italy) and Mirko Alesi (Milan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A leadframe includes a die pad having arranged thereon a first semiconductor die with an electrically conductive ribbon extending on the first semiconductor die. The first semiconductor die lies intermediate the leadframe and the electrically conductive ribbon. A second semiconductor die is mounted on the electrically conductive ribbon to provide, on the same...