ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,150, issued on Dec. 16, was assigned to STMICROELECTRONICS S.R.L. (Agrate Brianza, Italy).
"Semiconductor package with wettable flank" was invented by Federico Giovanni Ziglioli (Pozzo d'Adda, Italy).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present disclosure are directed to flat no-lead packages with wettable sidewalls or flanks. In particular, wettable conductive layers are formed on the package over lateral portions of the leads and on portions of the package body, which may be encapsulation material. The wettable conductive layers may also be formed on bottom surfaces of the package body and the leads. The wettable conduc...