US Patent Issued to STMicroelectronics on Dec. 16 for "Method of coupling semiconductor dice, tool for use therein and corresponding semiconductor device" (Italian Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,148, issued on Dec. 16, was assigned to STMicroelectronics S.r.l. (Agrate Brianza, Italy).

"Method of coupling semiconductor dice, tool for use therein and corresponding semiconductor device" was invented by Dario Vitello (Merate, Italy) and Michele Derai (Milan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An encapsulation of laser direct structuring (LDS) material is molded onto first and second semiconductor dice. A die-to-die coupling formation between the first and second semiconductor dice includes die vias extending through the LDS material to reach the first and second semiconductor dice and a die-to-die line extending at a surface of the e...