US Patent Issued to STMicroelectronics International on June 17 for "Embedded permeable polysilicon layer in MEMS device for multiple cavity pressure control" (Italian Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,330,934, issued on June 17, was assigned to STMicroelectronics International N.V. (Geneva).

"Embedded permeable polysilicon layer in MEMS device for multiple cavity pressure control" was invented by Federico Vercesi (Milan), Andrea Nomellini (Milan) and Paolo Ferrari (Va, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein is a process flow for forming a MEMS IMU including an accelerometer and a gyroscope each located in a separate sealed cavity maintained at a different pressure. Formation of the MEMS IMU includes the use of a first vHF release to etch a sacrificial layer underneath a structural layer containing the accelerometer and ...