US Patent Issued to STMicroelectronics France on Feb. 17 for "Method for manufacturing a set of electronic components on the front of a semiconductor substrate" (French Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,554,190, issued on Feb. 17, was assigned to STMicroelectronics France (Montrouge, France).

"Method for manufacturing a set of electronic components on the front of a semiconductor substrate" was invented by Matthieu Nongaillard (Grenoble, France) and Thomas Oheix (Grenoble, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention concerns a method of manufacturing an assembly of electronic components on a front surface of a semiconductor substrate comprising a plurality of field areas, each field area comprising at least one field and each field comprising at least one electronic component, the method comprising a plurality of photolithograph...