ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,498, issued on May 13, was assigned to STMICROELECTRONICS (TOURS) SAS (Tours, France).
"Transformer in a package substrate" was invented by Laurent Moindron (Vernou sur Brenne, France) and Ghafour Benabdelaziz (Tours, France).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present description concerns a device comprising at least one chip in a package, the package comprising a support, having the at least one chip resting thereon, and a protection layer covering the at least one chip, the support comprising a stack of layers made of an insulating material, a transformer being formed in the support by first and second conductive tracks."
The paten...