US Patent Issued to STMICROELECTRONICS (TOURS) on July 29 for "Die with metal pillars" (French Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,643, issued on July 29, was assigned to STMICROELECTRONICS (TOURS) SAS (Tours, France).

"Die with metal pillars" was invented by Olivier Ory (Tours, France) and Christophe Lebrere (Artannes sur Indre, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a die comprising metal pillars extending from a surface of the die, the height of each pillar being substantially equal to or greater than 20 micro metre, the pillars being intended to raise the die when fastening the die by means of a bonding material on a surface of a support. The metal pillars being inserted into the bonding material at which point the bonding ma...