US Patent Issued to STMicroelectronics (Malta) on Dec. 9 for "Integrated circuit package with warpage control using cavity formed in laminated substrate below the integrated circuit die" (Maltese Inventor)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,419, issued on Dec. 9, was assigned to STMicroelectronics (Malta) Ltd. (Kirkop, Malta).

"Integrated circuit package with warpage control using cavity formed in laminated substrate below the integrated circuit die" was invented by Roseanne Duca (Ghaxaq, Malta).

According to the abstract* released by the U.S. Patent & Trademark Office: "A support substrate includes an insulating core layer, an electrically conductive layer over the insulating core layer and a solder mask layer over the electrically conductive layer. A back side of an integrated circuit chip is mounted to an upper surface of the support substrate at a die attach location. The upper surface of the support substrate in...