US Patent Issued to STMicroelectronics (Grenoble 2) on Oct. 7 for "Thermal dissipation" (French Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,562, issued on Oct. 7, was assigned to STMicroelectronics (Grenoble 2) SAS (Grenoble, France).

"Thermal dissipation" was invented by Richard Rembert (Quai xen Chartreuse, France), Fanny Laporte (Villaz, France) and Catherine Cadieux (Grenoble, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation device includes a substrate with a network of thermally-conductive vias and thermally-conductive layers. The substrate has a first surface and a second surface opposite to the first surface. A heat dissipation interface layer including a stack of a first layer made of a first thermally-conductive material and a second layer made of a secon...