ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,657, issued on Oct. 28, was assigned to STMicroelectronics (Grenoble 2) SAS (Grenoble, France).
"Heat dissipating element" was invented by Michel Devers (Lumbin, France).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes an electronic die in a package and a heat diffusion element. The heat diffusion element is made of a thermally-conductive material and is formed of a single block (unitary body) that includes: a main portion resting on at least a portion of an upper surface of the electronic die; at least one secondary portion flush with an upper surface of the package; and at least one intermediate portion coupling the main...