ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,520, issued on Jan. 13, was assigned to STMicroelectronics (Grenoble 2) SAS (Grenoble, France).
"Electronics unit with integrated metallic pattern" was invented by Romain Coffy (Voiron, France) and Fabien Quercia (Saint Marcelin, France).
According to the abstract* released by the U.S. Patent & Trademark Office: "A non-conductive encapsulation cover is mounted on a support face of a support substrate to delimit, with the support substrate, an internal housing. An integrated circuit chip is mounted to the support substrate within the internal housing. A metal pattern is mounted to an internal wall of the non-conductive encapsulation cover in a position facing the support face. At ...