ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,922, issued on April 8, was assigned to STMICROELECTRONICS (GRENOBLE 2) SAS (Grenoble, France).
"Electronic chip support device and corresponding manufacturing method" was invented by Fabien Quercia (Saint Marcelin, France) and Jean-Michel Riviere (Froges, France).
According to the abstract* released by the U.S. Patent & Trademark Office: "Electronic device comprising a support substrate having a mounting face and an electronic chip having a rear face bonded on the mounting face by a volume of adhesive, wherein the support substrate comprises a plurality of wedging elements projecting from the mounting face so as to hold the chip bearing on contact areas of the wedging elements i...