US Patent Issued to STMicroelectronics (Grenoble 2) on April 29 for "Electronic device comprising a transparent encapsulation structure housing an electronic chip and corresponding production method" (French Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,961, issued on April 29, was assigned to STMicroelectronics (Grenoble 2) SAS (Grenoble, France).

"Electronic device comprising a transparent encapsulation structure housing an electronic chip and corresponding production method" was invented by Fabien Quercia (Isere, France) and Jean-Michel Riviere (Froges, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a base substrate having a mounting face. An electronic chip is fastened onto the mounting face of the base substrate. A transparent encapsulation structure is bonded onto the base substrate. The transparent encapsulation structure includes a housing with an interna...