US Patent Issued to STMicroelectronics (Grenoble 2) on April 15 for "Integrated circuit package with heat sink and manufacturing method thereof" (French Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,155, issued on April 15, was assigned to STMicroelectronics (Grenoble 2) SAS (Grenoble, France).

"Integrated circuit package with heat sink and manufacturing method thereof" was invented by Younes Boutaleb (Grenoble, France), Fabien Quercia (Isere, France), Asma Hajji (Voiron, France) and Ouafa Hajji (Voiron, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "A support substrate supports an electronic chip. An encapsulation coating on the support substrate coats the electronic chip. The encapsulation coating includes a trench surrounding the electronic chip. A heat sink is mounted to the encapsulation coating above the electronic chip. The heat si...