ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,514, issued on May 20, was assigned to STMicroelectronics (Crolles 2) SAS (Crolles, France).

"Thermal and electrical insulation structure" was invented by Sebastien Cremer (Sassenage, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a method of making an electronic device comprising a first wafer including at least one trench and a second wafer, the second wafer being bonded, by hybrid bonding, to the first wafer, so as to form, at the level of the trench, at least one enclosed space, empty or gas-filled."

The patent was filed on March 22, 2022, under Application No. 17/701,340.

*For further information, incl...