US Patent Issued to STMicroelectronics (Alps), STMicroelectronics (Grenoble 2) on May 6 for "Optical package" (French Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,292,607, issued on May 6, was assigned to STMicroelectronics (Alps) SAS (Grenoble, France) and STMicroelectronics (Grenoble 2) SAS (Grenoble, France).

"Optical package" was invented by Deborah Cogoni (Notre Dame de l'Osier, France), Raphael Goubot (Grenoble, France) and Younes Boutaleb (Grenoble, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "An optical package includes a substrate made of a first material having an upper surface and a lower surface. The substrate further includes at least one cavity opening onto an upper surface of the substrate. Electrical connection vias extend through the substrate. An electronic integrated circuit chip is mo...