US Patent Issued to STMICROELECTRONICS, STMICROELECTRONICS on July 15 for "Sensor die package" (Singaporean, Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,364,038, issued on July 15, was assigned to STMICROELECTRONICS LTD (Kowloon, Hong Kong) and STMICROELECTRONICS PTE LTD (Singapore).

"Sensor die package" was invented by David Gani (Choa Chu kang, Singapore) and Yiying Kuo (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to a package that includes a transparent layer that is on and covers a sensor of a die as well as a plurality of electrical connections that extend from a first surface of the package to the second surface of the package opposite to the first surface. In at least one embodiment of a package, the electrical connections each include a condu...