US Patent Issued to STMicroelectronics, STMicroelectronics (Crolles 2) on Jan. 28 for "Semiconductor chip manufacturing method" (Italian, French Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,754, issued on Jan. 28, was assigned to STMicroelectronics S.r.l. (Agrate Brianza, Italy) and STMicroelectronics (Crolles 2) SAS (Crolles, France).

"Semiconductor chip manufacturing method" was invented by Pierpaolo Monge Roffarello (Milan), Isabella Mica (Sesto San Giovanni, Italy), Didier Dutartre (Meylan, France) and Alexandra Abbadie (Montbonnot-Saint-Martin, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate made of doped single-crystal silicon has an upper surface. A doped single-crystal silicon layer is formed by epitaxy on top of and in contact with the upper surface of the substrate. Either before or after forming the doped s...