ALEXANDRIA, Va., March 19 -- United States Patent no. 12,256,500, issued on March 18, was assigned to STEMCO Co. LTD. (Cheongju-si, South Korea).
"Circuit board and manufacturing method therefor" was invented by Jin Han Lee (Cheongju-si, South Korea), Sung Jin Lee (Cheongju-si, South Korea) and Jin Ho Kim (Cheongju-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board includes: a base substrate in which a protective layer formation region is defined; a wiring pattern which is formed on the base substrate and which has at least a portion formed in the protective layer formation region; a protective layer fixed onto the protective layer formation region and formed of a protective mater...