US Patent Issued to STEMCO on July 29 for "Circuit board and method for manufacturing same, and electronic device comprising same circuit board" (South Korean Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,238, issued on July 29, was assigned to STEMCO Co. LTD. (Cheongju-si, South Korea).

"Circuit board and method for manufacturing same, and electronic device comprising same circuit board" was invented by Sung Jin Lee (Cheongju-si, South Korea), Kang Dong Kim (Seoul, South Korea), Chang Hoon Han (Sejong, South Korea), Chul Ho Yoon (Cheongju-si, South Korea), Ho Byung Kim (Cheongju-si, South Korea), Hyun Woo Kim (Cheongju-si, South Korea) and Gun Woo Shin (Cheongju-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board including a contact terminal on a side thereof, a method of fabricating the circuit board, and an electronic de...