US Patent Issued to STATS CHIPPAC SEMICONDUCTOR (JIANGYIN) on Feb. 10 for "Elastic heat spreader for chip package, package structure and packaging method" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,727, issued on Feb. 10, was assigned to STATS CHIPPAC SEMICONDUCTOR (JIANGYIN) Co. LTD. (Wuxi, China).

"Elastic heat spreader for chip package, package structure and packaging method" was invented by Man Bao (Wuxi, China) and Weijun Wang (Wuxi, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention discloses an elastic heat spreader for chip packaging, a packaging structure and a packaging method. The heat spreader includes a top cover plate and a side cover plate that extends outward along an edge of the top cover plate, wherein the top cover plate is configured to be placed on a chip, and at least a partial region of the side c...