US Patent Issued to STATS ChipPAC on Sept. 9 for "Compartment shielding with metal frame and cap" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,792, issued on Sept. 9, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Compartment shielding with metal frame and cap" was invented by Bokyeong Hwang (Incheon, South Korea), Jingwan Kim (Incheon, South Korea) and Minjung Kim (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate and a first semiconductor die disposed over the substrate. A first metal frame is disposed over the substrate around the first semiconductor die. A first metal lid is disposed over the first metal frame. A flap of the first metal lid includes an elastic characteristic to latch onto the first metal frame. An edge of...