US Patent Issued to STATS ChipPAC on Sept. 30 for "Semiconductor device and method of forming thin heat sink using e-bar substrate" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,405, issued on Sept. 30, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of forming thin heat sink using e-bar substrate" was invented by Jongtae Kim (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate and a semiconductor package disposed over the substrate. An embedded bar (e-bar) substrate is disposed on the substrate around the semiconductor package. A heat sink is formed over the semiconductor package and supported by the e-bar substrate to elevate the heat sink from the substrate and reduce a thickness of the heat sink. A thermal interface material is...