US Patent Issued to STATS ChipPAC on Sept. 30 for "Semiconductor device and method of forming RDL with graphene-coated core" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,422, issued on Sept. 30, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of forming RDL with graphene-coated core" was invented by YongMoo Shin (Incheon, South Korea), HyunSeok Park (Gyeonggi-do, South Korea), KyoWang Koo (Incheon, South Korea) and Sinjae Kim (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a one-layer interconnect substrate and electrical component disposed over a first surface of the interconnect substrate. The electrical components can be discrete electrical devices, IPDs, semiconductor die, semiconductor packages, surface mount devices, and RF ...