US Patent Issued to STATS ChipPAC on Sept. 30 for "Semiconductor device and method for partial EMI shielding" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,438, issued on Sept. 30, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method for partial EMI shielding" was invented by JinHee Jung (Incheon, South Korea) and ChangOh Kim (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate. An electrical component is disposed over the substrate. An encapsulant is deposited over the electrical component. A vertical interconnect structure is disposed in the encapsulant. A shielding layer is formed over the encapsulant and vertical interconnect structure. A groove is formed in the shielding layer around the vertical intercon...