US Patent Issued to STATS ChipPAC on Sept. 23 for "Semiconductor device and method of forming package with double-sided integrated passive device" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,595, issued on Sept. 23, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of forming package with double-sided integrated passive device" was invented by TaeKeun Lee (Incheon, South Korea) and Hyunil Bae (Chungcheongnam-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a semiconductor die, substrate, and plurality of first conductive pillars formed over the semiconductor die or substrate. Alternatively, the first conductive pillars formed over the semiconductor die and substrate. An electrical component is disposed over the semiconductor die. The electrical component can b...