US Patent Issued to STATS ChipPAC on Sept. 16 for "Semiconductor device and method of detecting semiconductor wafer centered on tape" (Singaporean Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,939, issued on Sept. 16, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of detecting semiconductor wafer centered on tape" was invented by Tack Chee Yong (Singapore), Yi Jing Eric Chong (Singapore), Kok Lim Jason Ng (Singapore) and Linda Pei Ee Chua (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor manufacturing equipment has a wafer tape including a plurality of alignment holes formed through the wafer tape. A semiconductor wafer is disposed over the wafer tape. The semiconductor wafer includes a circular or rectangular form-factor. A light source is disposed under the wafer tape. The ...