US Patent Issued to STATS ChipPAC on Oct. 7 for "Semiconductor device and method of forming EMI shielding material in two-step process to avoid contaminating electrical connector" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,099, issued on Oct. 7, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of forming EMI shielding material in two-step process to avoid contaminating electrical connector" was invented by ChangOh Kim (Incheon, South Korea), JinHee Jung (Incheon, South Korea) and OMin Kwon (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate and encapsulant deposited over the substrate. An electrical connector is disposed over the substrate outside the encapsulant. An antenna can be formed over the substrate. A first shielding material is disposed over a portion of the encapsula...