ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,620, issued on Oct. 14, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).
"Semiconductor device and method of forming SiP module absent substrate" was invented by JiEun Kwon (Incheon, South Korea), JiSik Moon (Incheon, South Korea), KiCheol Lee (Incheon, South Korea) and BoLee Lim (Incheon, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a sacrificial substrate and an electrical component disposed over the sacrificial substrate. A bump stop layer is formed within the sacrificial substrate. At least a portion of the bump or terminal of the electrical component is embedded into the sacrificial substrate to cont...