US Patent Issued to STATS ChipPAC on Oct. 14 for "Semiconductor device and method of forming selective EMI shielding with slotted substrate" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,694, issued on Oct. 14, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of forming selective EMI shielding with slotted substrate" was invented by JinHee Jung (Incheon, South Korea), ChangOh Kim (Incheon, South Korea), JiWon Lee (Seoul, South Korea) and YuJeong Jang (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate and a slot formed in the substrate. A first electrical component is disposed over the substrate adjacent to the slot. An encapsulant is deposited over the first electrical component with a surface of the encapsulant coplanar to a surface of the...