US Patent Issued to STATS ChipPAC on Oct. 14 for "Semiconductor device and method for reducing metal burrs using laser grooving" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,639, issued on Oct. 14, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method for reducing metal burrs using laser grooving" was invented by ChangOh Kim (Incheon, South Korea), JinHee Jung (Incheon, South Korea), DaePark Lee (Gyeonggi-do, South Korea), YoungKang Lee (Incheon, South Korea) and YongJin Jeong (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device is formed using a jig. The jig includes a metal frame, a polymer film, and an adhesive layer disposed between the metal frame and polymer film. An opening is formed through the adhesive layer and polymer film. A groove is for...