US Patent Issued to STATS ChipPAC on Nov. 25 for "Semiconductor device and method of making an interconnect bridge with integrated passive devices" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,755, issued on Nov. 25, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of making an interconnect bridge with integrated passive devices" was invented by YongTaek Lee (Seoul, South Korea), JaeMyeong Kim (Incheon, South Korea) and DaAe Lee (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a first substrate. A first semiconductor die and second semiconductor die are disposed over the substrate. An interconnect bridge is disposed over the first semiconductor die and second semiconductor die. The interconnect bridge has a second substrate. A conductive trace is formed ov...