US Patent Issued to STATS ChipPAC on Nov. 11 for "Semiconductor device and method of stacking hybrid substrates with embedded electric components" (Singaporean, Chinese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,791, issued on Nov. 11, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of stacking hybrid substrates with embedded electric components" was invented by Yaojian Lin (Jiangsu Province, China), Linda Pei Ee Chua (Singapore), Ching Meng Fang (Singapore) and Hin Hwa Goh (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a first RDL substrate with first conductive pillars formed over a first surface of the first RDL substrate. A first electrical component is disposed over the first surface of the first RDL substrate. A hybrid substrate is bonded to the first RDL substrate. An encapsu...