US Patent Issued to STATS ChipPAC on Nov. 11 for "Semiconductor device and method of forming embedded wafer level chip scale packages" (Singaporean Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,819, issued on Nov. 11, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of forming embedded wafer level chip scale packages" was invented by Yaojian Lin (Singapore), Pandi C. Marimuthu (Singapore), Il Kwon Shim (Singapore) and Byung Joon Han (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor die and an encapsulant deposited over and around the semiconductor die. A semiconductor wafer includes a plurality of semiconductor die and a base semiconductor material. A groove is formed in the base semiconductor material. The semiconductor wafer is singulated through...