US Patent Issued to STATS ChipPAC on Nov. 11 for "Method of forming an embedded magnetic shielding device" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,796, issued on Nov. 11, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Method of forming an embedded magnetic shielding device" was invented by ChangOh Kim (Incheon, South Korea), JinHee Jung (Incheon, South Korea) and OMin Kwon (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate. A semiconductor die is disposed over the substrate. A first encapsulant is deposited over the semiconductor die. A ferromagnetic film is disposed over the first encapsulant. A second encapsulant is deposited over the ferromagnetic film. A shielding layer is optionally formed over the substrate, first encapsulan...