US Patent Issued to STATS ChipPAC on May 20 for "Semiconductor manufacturing device and method of enhancing mold gate injector and air vent to reduce voids in encapsulant" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,304,122, issued on May 20, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor manufacturing device and method of enhancing mold gate injector and air vent to reduce voids in encapsulant" was invented by HunTeak Lee (Gyeongi-do, South Korea) and KyungHwan Kim (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor manufacturing device has a strip panel and a plurality of electrical components disposed over the strip panel. An encapsulant is disposed over the electrical components using a mold gate injector and directed in a path toward higher flow resistance for the encapsulant over the electrical components....