US Patent Issued to STATS ChipPAC on June 3 for "Semiconductor device and method of forming microelectromechanical systems (MEMS) package" (Singaporean, Chinese, French Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,319,564, issued on June 3, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of forming microelectromechanical systems (MEMS) package" was invented by Yaojian Lin (Jiangyin, China), Won Kyoung Choi (Singapore), Kang Chen (Singapore) and Ivan Micallef (Veurey-Voroize, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a first semiconductor die and a modular interconnect structure adjacent to the first semiconductor die. An encapsulant is deposited over the first semiconductor die and modular interconnect structure as a reconstituted panel. An interconnect structure is formed over the first ...