US Patent Issued to STATS ChipPAC on June 24 for "Shielded semiconductor package with open terminal and methods of making" (South Korean Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,108, issued on June 24, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Shielded semiconductor package with open terminal and methods of making" was invented by ChangOh Kim (Incheon, South Korea), KyoWang Koo (Incheon, South Korea), SungWon Cho (Seoul, South Korea), BongWoo Choi (Seoul, South Korea) and JiWon Lee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate. An electrical component is disposed over a surface of the substrate. An encapsulant is deposited over the electrical component and substrate. A portion of the surface of the substrate remains exposed from the encapsulant. A shiel...