ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,799, issued on June 10, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).
"Semiconductor device and method of forming multi-layer shielding structure with layers of ferromagnetic material, protective material, laminate material or conductive material over the semiconductor device" was invented by ChangOh Kim (Incheon, South Korea), JinHee Jung (Incheon, South Korea), JiWon Lee (Seoul, South Korea) and YuJeong Jang (Incheon, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate and electrical components disposed over the substrate. An encapsulant is disposed over the substrate and electrical components. ...