US Patent Issued to STATS ChipPAC on July 8 for "Semiconductor device and method of forming an embedded redistribution layer" (South Korean Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,990, issued on July 8, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of forming an embedded redistribution layer" was invented by Junghwan Jang (Incheon, South Korea), Giwoong Nam (Incheon, South Korea) and Myongsuk Kang (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a semiconductor die. A first dielectric layer is formed over the semiconductor die. A second dielectric layer is formed over the first dielectric layer. A trench is formed in the second dielectric layer. A via opening is formed to expose a contact pad of the semiconductor die within the trench. A see...