US Patent Issued to STATS ChipPAC on July 29 for "Semiconductor device and method of forming electrical circuit pattern within encapsulant of sip module" (South Korean Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,593, issued on July 29, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of forming electrical circuit pattern within encapsulant of sip module" was invented by JinHee Jung (Incheon, South Korea) and ChangOh Kim (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has an electronic component assembly with a substrate and a plurality of electrical components disposed over the substrate. A conductive post is formed over the substrate. A molding compound sheet is disposed over the electrical component assembly. A carrier including a first electrical circuit pattern is disposed ...