US Patent Issued to STATS ChipPAC on July 29 for "Double-sided partial molded SiP module" (South Korean Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,559, issued on July 29, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Double-sided partial molded SiP module" was invented by HunTeak Lee (Gyeongi-do, South Korea), Gwang Kim (Gyeongi-do, South Korea) and Junho Ye (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate and a first component disposed over a first surface of the substrate. A connector is disposed over the first surface of the substrate. A first encapsulant is deposited over the first component while the connector remains outside of the first encapsulant. A shielding layer is formed over the first encapsulant while the connector...