US Patent Issued to STATS ChipPAC on Jan. 28 for "Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,803, issued on Jan. 28, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation" was invented by HunTeak Lee (Gyeongi-do, South Korea), Gwang Kim (Gyeongi-do, South Korea), Junho Ye (Seoul, South Korea), YouJoung Choi (Gyeonggi-do, South Korea), MinKyung Kim (Incheon, South Korea), Yongwoo Lee (Incheon, South Korea) and Namgu Kim (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate and an electrical component disposed over a surface of the substrate. An antenna interpose...