US Patent Issued to STATS ChipPAC on Jan. 28 for "Semiconductor device and method of forming bump pad array on substrate for ground connection for heat sink/shielding structure" (American, South Korean Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,778, issued on Jan. 28, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of forming bump pad array on substrate for ground connection for heat sink/shielding structure" was invented by Hermes T. Apale (Shrewsbury, Mass.), KyuWon Lee (Kyunggi-do, South Korea) and Mark Sackett (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate and plurality of first bumps formed over the substrate in an array. An array of second bumps is formed over the substrate on at least two sides of the first bumps. An electrical component is disposed over the first bumps. A package structure...