US Patent Issued to STATS ChipPAC on Jan. 27 for "Semiconductor device and method of forming module-in-package structure using redistribution layer" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,840, issued on Jan. 27, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of forming module-in-package structure using redistribution layer" was invented by GunHyuck Lee (Gyeonggi-do, South Korea), Yujeong Jang (Incheon, South Korea), Gayeun Kim (Seoul, South Korea) and YoungUk Noh (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a first semiconductor package, second semiconductor package, and RDL. The first semiconductor package is disposed over a first surface of the RDL and the second semiconductor package is disposed over a second surface of the RDL opposite the fir...