US Patent Issued to STATS ChipPAC on Jan. 13 for "System and method of providing FOUP or cassette supporting structure for handling various size or shape wafers and panels" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,478, issued on Jan. 13, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"System and method of providing FOUP or cassette supporting structure for handling various size or shape wafers and panels" was invented by Yaojian Lin (Jiangyin, China), DanFeng Yang (Jiangyin, China) and SongHua Xu (Jiangyin, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A front opening unified pod has a housing and a plurality of horizontal support members disposed within the housing and adapted to accommodate a plurality of semiconductor wafers or panels. The plurality of semiconductor wafers or panels have a different size or shape, such as circular and rectangu...