US Patent Issued to STATS ChipPAC on Jan. 13 for "Semiconductor device and method of forming vertical interconnect structure for pop module" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,587, issued on Jan. 13, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of forming vertical interconnect structure for pop module" was invented by Junghwan Jang (Incheon, South Korea), Giwoong Nam (Incheon, South Korea) and Myongsuk Kang (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate and a first light sensitive material formed over the substrate. A plurality of first conductive posts is formed over the substrate by patterning the first light sensitive material and filling the pattern with a conductive material. A plurality of electrical contacts is for...